AMD adopts Unitive wafer bumping technology

Advanced Micro Devices Inc. (AMD) has signed Unitive Inc. to provide its proprietary electroplated wafer bumping technology for AMD's microprocessor chipsets assembly process.

Unitive's wafer bumping will be used to assemble flip-chips on organic or ceramic packages by AMD's packaging assembly partners. The manufacturing solution will be provided through Unitive Semiconductor Taiwan located in Hsin Chu. Further, Unitive will be collaborating with Advanced Semiconductor Engineering to provide flip-chip packaging and final testing.