ChipPAC deploys Teradyne test systems at Malaysia plant

ChipPAC Inc., a semiconductor assembly and test services provider, has purchased multiple Catalyst test systems for wireless device testing from Teradyne Inc. ChipPAC will deploy the Teradyne test systems at their test facility in Malaysia, for final production test of IC products.

"Teradyne offers test service providers, like ChipPAC, a solution for RF testing which has the ability to cover a wide range of devices," said David Derian, marketing manager for Wireless/RF at Teradyne. "Catalyst's DSP architecture enables multisite tests. The Catalyst series with MicroWAVE6000 covers test requirements for WLAN and Bluetooth devices and mobile phone standards such as GSM, CDMA, and WCDMA."