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UMC adopts Agilent solution for 300mm wafer testing

Posted: 23 Apr 2003 ?? ?Print Version ?Bookmark and Share

Keywords:umc? agilent? wafer parametric testing?

Semiconductor foundry United Microelectronics Corp. (UMC) has selected Agilent Technologies Inc.'s 4070|300 system for fully automated 300mm wafer parametric testing.

The 4070|300 offers throughput by placing the dc measurement resources in the test head and using intelligent measurement range control to speed up sweep measurements by 30 percent or more. The 4070|300 solution supports all current SEMI automation standards, which is expected to reduce UMC's cost of testing by decreasing the time required to integrate the 4070|300 into its overall 300mm factory environment.

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