Toshiba to manufacture 300mm wafers at new fab

Toshiba Corp. will start in June the construction of an advanced 300mm-wafer cleanroom for system LSIs at its Oita Operations plant in Oita prefecture, Kyushu, Japan. The fab is set to commence mass production in the 1H of fiscal year 2004, and once it reaches full production, will have a capacity of 12,500 300mm wafers a month.

The new Oita fab will produce system LSIs, mainly microprocessors for broadband network applications. It will employ Toshiba's embedded DRAM process technology and 65nm process technology, and will transition to 45nm process in the future.

Toshiba is currently working with Sony Computer Entertainment Inc. (SCEI) on joint implementation of production facilities for the manufacture of SCEI's products in Oita's new cleanroom.