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Shennan multilayer PCBs suit mobile phones

Posted: 25 Apr 2003 ?? ?Print Version ?Bookmark and Share

Keywords:Shenzhen Shennan circuits? hdi pcb? multilayer pcb? mobile phone pcb?

Shenzhen Shennan Circuits Co. Ltd has announced the availability of multilayer HDI PCBs that are designed for use in mobile phones. Available in 6- to 8-layer models, the PCBs are made with FR-4 base material and offer 75?m laser-drilled blind vias. They have a maximum board area of 0.61-by-1.1mm and have a board thickness between 0.35mm to 8mm.

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