Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > T&M

China's GAPT deploys Teradyne device test system

Posted: 29 Apr 2003 ?? ?Print Version ?Bookmark and Share

Keywords:global advanced packaging technology? teradyne? ic test system? digital consumer IC?

Global Advanced Packaging Technology Co. Ltd (GAPT) of Shanghai, China, has purchased another test system from Teradyne Inc. - the Catalyst, for a wide range of device testing. GAPT offers various services from packaging design, wafer bumping, wafer sort, die storage, assembly to final test and drop ship.

The system will be installed at GAPT's Zhangjiang Hi-Tech Park facility. The Catalyst will test DVD, chipset, baseband, disk controller, and RF devices used in the consumer, computer, wireless and communication industries.

Article Comments - China's GAPT deploys Teradyne device...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top