Silver epoxy adhesive suits microelectronics apps

Tra-Con Singapore has announced the release of the Tra-Duct 2958 snap cure, conductive silver epoxy adhesive that is designed for use in microelectronics applications.

The adhesive is a two-part smooth paste of specially refined and processed epoxy and silver components, which is claimed to have a long pot life and is free of contaminants and additives.

It is capable of developing void-free, electrically, and thermally conductive bonds, seals, and coatings, making it suitable for electronic, microelectronics, and die-attach bonding and sealing applications, as well as chip bonding.

The company has also announced the release of the Tra-Cast F311 semi-flexible casting epoxy. The low viscosity formulation is optically transparent and is developed for molding, embedding, casting, and potting applications. It is claimed to exhibit low-shrinkage and is resistant to water, lubricants, weathers, and mile acids and alkali.