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ChipPAC PBGA packaging targets high-power ICs

Posted: 21 May 2003 ?? ?Print Version ?Bookmark and Share

Keywords:tebga-II? tebga-IIplus? array packaging?

ChipPAC Inc. has announced the availability of its thermally-enhanced PBGA packaging TEBGA-II and TEBGA-IIplus.

TEBGA-II is an exposed, drop-in heat slug BGA package with a 30 percent enhanced thermal performance compared to conventional PBGAs, and over 100 percent of an equivalent cavity down thermal BGA or flip-chip BGA. The package has passed all package level reliability tests, including lead-free preconditioning.

TEBGA-IIplus includes the same exposed drop-in heat slug and passive components surface mounted within the mold cap and adjacent to the chip to enhance both thermal and electrical performance. This technology includes a larger and thicker drop-in heat slug as compared to TEBGA, yet maintains the same footprint and thickness of a conventional PBGA.

Both devices have a higher heat-dissipating and are cost effective alternatives for applications demanding higher power and speed ICs.

The package family range from the 23-by-23mm 324-ball to the 40-by-40mm 928-ball. The popular 35-by-35mm 680-ball TEBGA-II with over 1,000 wires extends the power dissipation of an equivalent conventional PBGA into the range of 4W to 6W with a marginal 20 percent cost increment.

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