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OEA upgrades spiral inductor synthesis

Posted: 23 May 2003 ?? ?Print Version ?Bookmark and Share

Keywords:spiral? 3d toolset? embedded spiral inductor? patterned ground shield? oea?

OEA Int'l Inc. is claiming a major upgrade for Spiral, a 3D toolset for synthesizing embedded spiral inductors in analog and RF chips, hybrids, multichip modules, and PCBs. If used within the Cadence Design Framework, Spiral generates layout, schematic and symbol views for users.

New features include a refined substrate modeling capability that promises to improve both accuracy and performance. Substrate models can now handle increased complexity, including epitaxial layers, implants, silicon, GaAs and silicon-on-insulator. OEA has improved the prediction of resonance frequency and losses in the substrate due to displacement and eddy currents.

The new release supports a variety of parallel metal layers in the winding or cross-under, allowing users to reduce series resistance. The feature is useful when inductors are used at lower frequencies.

Spiral has also added automatic generation of patterned ground shields (PGS). However, it warns the user if the PGS is being used inappropriately.

Spiral generates GDSII layouts; s, y, and z parameters; inductance, resistance, and quality factor versus frequency plots; and compact Spice models. It's available now starting at $75,000.

- Richard Goering

EE Times

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