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Dynex modules optimized for high thermal cycling

Posted: 26 May 2003 ?? ?Print Version ?Bookmark and Share

Keywords:Dynex? trench fieldstop technology? soft punch-through technology?

Dynex Semiconductor has released three GBT module product ranges in single, half-bridge, chopper, and dual switch circuit configurations for high reliability applications.

The 1200V and 1700V modules incorporate trench fieldstop technology while the 3500V modules feature soft punch-through technology. Switching and conduction losses are significantly reduced compared to previous module ranges.

All modules are optimized for high thermal cycling and are available in industry standard footprint packages constructed with isolated metal matrix baseplates and AlN substrates.

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