Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

ANADIGICS obtains patents for wafer processing innovation

Posted: 30 May 2003 ?? ?Print Version ?Bookmark and Share

Keywords:anadigics? semiconductor manufacturing processes? surface mount?

ANADIGICS Inc., a supplier of wireless and broadband communications solutions, has received two new patents relating to the improvement of its semiconductor manufacturing processes.

The patents are for a newly developed wafer demount gas distribution tool and for a wafer demount receptacle for separating the thinned wafer from the mounting carrier. ANADIGICS' wafer gas demount distribution tool is to be used during the demounting process to help aid the separation of the wafer from the carrier.





Article Comments - ANADIGICS obtains patents for wafer ...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top