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Silicon Wave Bluetooth die provides high-density integration

Posted: 18 Jun 2003 ?? ?Print Version ?Bookmark and Share

Keywords:rf micro devices? silicon wave? ultimateblue 3000? radio processor? siw1712?

Silicon Wave has announced that their single-chip Bluetooth processors, the UltimateBlue 3000 radio and the SiW1712 modem, are available as standalone bare die products, also known as Known Good Die (KGD).

By supplying customers with a fully tested, small and ultra-thin die, the company enables Bluetooth functionality in a reduced size that is suitable for high-density integration into miniature assemblies. This strategy is expected to meet existing customer requirements for cost-effective, small form factor Bluetooth solutions, especially for module products in mobile phones.

The single-chip UltimateBlue 3000 delivers high-performance capabilities while being implemented on a low cost 0.18?m CMOS process. The IC combines a direct conversion radio modem with an ARM7TDMI processor core, Bluetooth baseband logic, and complete protocol software in ROM.

The single-chip SiW1712 radio modem combines a 2.4GHz direct conversion radio transceiver and a GFSK burst modem, with digital control functions, into a single piece of silicon. It is also implemented on the 0.18?m CMOS process, and is specifically designed for mobile phones using CDMA-compatible chipsets with integrated Bluetooth baseband.





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