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Lead Bending and Soldering Considerations for International Rectifier's Power Semiconductor Packages

Posted: 27 Jun 2003 ?? ?Print Version ?Bookmark and Share

Keywords:international rectifier? power semiconductor package? ic soldering? ic package solder? ic package mounting?

This application note is intended to address how the legs of through-hole packaged devices be bent safely without endangering its reliability and how through-hole and SMD parts be soldered safely.

View the PDF document for more information.

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