Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > T&M
?
?
T&M??

TSMC, Amkor partner on flip-chip packaging

Posted: 07 Jul 2003 ?? ?Print Version ?Bookmark and Share

Keywords:amkor technology? tsmc? wirebond? flip chip?

Amkor Technology Inc. has developed and qualified wirebond and flip-chip packaging for devices manufactured on Taiwan Semiconductor Mfg Co. Ltd's (TSMC) advanced low-k process technologies. Amkor has also worked with several customers on low-k product qualification, and expects volume ramp-up for low-k packages in 2H of 2003.

Amkor has already qualified wirebond and flip-chip packaging for TSMC's 0.13?m, low-k technology early this year. Currently, Amkor's primary research focus is on qualification and production preparation of 90nm packages. TSMC has reported more than twenty 90nm customer projects, which are at various levels of the design stage.





Article Comments - TSMC, Amkor partner on flip-chip pac...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top