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SECAP installs wafer line at Hsinchu

Posted: 07 Jul 2003 ?? ?Print Version ?Bookmark and Share

Keywords:semiconductor equipment consortium for advanced packaging? secap? wafer bumping? wafer level packaging? Unitive Semiconductor?

The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) has installed a 300mm wafer bumping and wafer level packaging (WLP) line at Unitive Semiconductor Taiwan Corp., located in Hsinchu, Taiwan. UST will use the installed integrated process equipment for high-volume manufacturing.

Originally announced in July 2002, SECAP and Unitive agreed to install the 300mm wafer bumping line to address the demands of WLP. With the SECAP process installation complete, the 300mm line is now available to customers and prospective customers of SECAP member companies for equipment demonstrations and process evaluation.

"With this collaboration, Unitive and SECAP continue to set the standard for wafer level packaging technologies. We will continue to offer the industry the most advanced and reliable technologies, which meet production needs today and provide a clear path for future needs," commented Dan Mis, VP of Applications Engineering for Unitive.

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