Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Controls/MCUs
?
?
Controls/MCUs??

ARM to co-market TransDimension USB technology

Posted: 11 Jul 2003 ?? ?Print Version ?Bookmark and Share

Keywords:arm? transdimension? usb connectivity? otg core? usg?

ARM Ltd and USB connectivity solutions provider TransDimension have formed an alliance to jointly market the TransDimension USB OTG core to ARM partners worldwide. The alliance will offer ARM partners a complete solution for proven USG On-The-Go (OTG) solutions for ARM core-based processors. This will be backed up by comprehensive software support from SoftConnex, a TransDimension subsidiary.

In relation to this, TransDimension's OTG IP core has received an AMBA Compliance Testbench (ACT) certification for its full-speed USB. The OTG IP core is claimed to be the first OTG core in the industry to obtain such certification.

"This initiative combines the strengths of two industry leading IP providers for embedded and mobile applications. TransDimension's USB OTG and host technology complements the ARM processor and PrimeXsys IP cell libraries," said Rick Goerner, president and CEO, TransDimension. "We have committed to a collaborative effort with ARM that will offer ACT-certified products, and eventually PrimeXsys Platform-compatible product to their Partners and to the rest of the marketplace."





Article Comments - ARM to co-market TransDimension USB ...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top