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FEI metrology system speeds-up chip development

Posted: 17 Jul 2003 ?? ?Print Version ?Bookmark and Share

Keywords:clm-3d? fei? dualbeam? metrology system? certus 3d system?

The CLM-3D from FEI Co. is an in-fab fully automated DualBeam metrology system designed for rapid process development and process control of new semiconductor technologies below 130nm.

Based on the platform of Certus 3D system for data storage, the high-throughput CLM-3D is designed to give process managers rapid, statistically significant control of complex structures and sub-surface features.

By reducing time-to-data, the product makes it possible to evaluate processes to the levels demanded by sub-130nm devices. Combined with the ability to keep process wafers in the fab, the product is designed to improve yields and provide device performance indicators by controlling critical process steps early in the manufacturing cycle.

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