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TSMC, Applied Materials ink deal on ECP development

Posted: 21 Jul 2003 ?? ?Print Version ?Bookmark and Share

Keywords:tsmc? applied materials? copper chips? ecp? electrochemical plating system?

Taiwan Semiconductor Mfg Co. Ltd (TSMC) has entered into a joint development agreement with Applied Materials Inc. to develop TSMC's next-generation of copper chips on Applied Materials' latest SlimCell ECP (electrochemical plating) system.

Dr. M.S. Liang, senior director of TSMC R&D, said, "Our early work with SlimCell ECP demonstrated the defect elimination capability of this new plating technology. We appreciate Applied Materials' product innovation and excellent support and look forward to continuing this close relationship."

Applied Materials' SlimCell ECP system features a new platform, plating cell and small chemical bath design that increases the technical capability, process repeatability, and production-worthiness of the electroplating process. The system's design links a small-volume plating cell to its own small chemical tank, which is completely replaced after processing a set number of wafers.

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