DSP Architectures rolls 0.35?m processor

DSP Architectures has commenced shipping of its RHDSP24 offering, a radiation-hardened, high-performance frequency domain digital signal processor (DSP) that uses the 0.35?m advanced Silicon-on-Insulator (SOI) V rad-hard four-layer metal process technology.

The DSP can perform a 1,024-point complex FFT in 16.5?s continuously, and is suitable for use in Fast Fourier Transforms, software radio, polyphase filtering, spread-spectrum processing, COFDM, OFDM, and FDM, signal intelligence, satellite electronics, real-time spectral analysis, advanced spacecraft processing, telecommunications, and radar/sonar signal processing.

Packaged in a 472-pin column grid array, the DSP IC is available in extended temperature ranges. Commercial equivalent chips are available for prototyping, and are priced at $500 to $1,500 each, depending on quantity, performance, and temperature grade.