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Toshiba subsidiary pushes for lead-free manufacturing

Posted: 01 Aug 2003 ?? ?Print Version ?Bookmark and Share

Keywords:toshiba? taec? lead-free manufacturing? flash memory-based storage solution? optical communication device?

Toshiba America Electronic Components Inc. (TAEC) has announced that it is implementing manufacturing procedures using new materials that support the current industry movement to lead-free manufacturing. In relation to this, TAEC has developed a plan to transition a portion of its manufacturing to lead-free by the end of 2003.

The lead-free measures the company is pursuing vary from product to product. However, the first step in TAEC's transition plan is making the packages for certain semiconductor products lead-free. Toshiba has evaluated soldering in terms of materials, chemicals, terminal finishes, and thermal resistance to choose the optimal alternative to be applied in each product category.

TAEC's implementation of this initiative is driven in part because of the pending European Community directives for Wastes from Electric and Electronic Equipment (WEEE) and Restriction of Hazardous Substances (RoHS).

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