Wafer inspection system allows rapid testing

Nikon's Semiconductor Inspection Technologies Group (SITECH) has introduced the AMI-3000 wafer inspection system that is designed to meet the automated 300mm wafer production in the 90nm technology node and beyond.

Designed primarily to address after-develop inspection, the AMI-3000 can also be adapted to serve nearly all post-process inspection steps within a fab. Its automated macroscopic wafer inspection unit features a wafer imaging system that captures the entire wafer surface area and achieves a throughput of more than 150 wafers per hour.

The product is also supported with tested automated defect identification and categorization software tools. Optional backside and edge defect detection modules are also available for purchase to compliment the system.