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ITC 2003 to focus on MEMS technology

Posted: 14 Aug 2003 ?? ?Print Version ?Bookmark and Share

Keywords:international test conference? itc 2003? mems technology? ic test? board testing?

This year's test conference covering IC and board test issues will shift its focus to microelectromechanical system (MEMS) technology as a growing concern for test engineers.

Scheduled for the week of Sept. 29, the International Test Conference (ITC 2003) in Charlotte, North Carolina, will include two MEMS lecture series. An introductory session will cover fabrication of MEMS devices. Lecturers by engineers from Sandia National Laboratories and Carnegie Mellon University will cover design, fabrication and industrial uses of MEMs devices.

A MEMS testing session will delve into the failure mechanisms of MEMS devices. Building from the failure information, speakers will detail the testing of MEMs devices.

This year's conference theme is "Breaking the test interface bottlenecks." Speakers will cover topics ranging from nanotechnology to system testing.

David Yen, EVP, Processor and Network Products, Sun Microsystems, will discuss chip testing from the perspective of a network hardware provider. He will argue in a keynote speech that today's servers require a higher level of reliability and availability, which must be built into software and hardware from the beginning.

Yen will describe how Sun leverages its processors and ASICs to improve test and reliability, and what manufacturers need from the ATE and EDA communities.

"Test Challenges of Nanometer Technology" is the subject of the second keynoter, Janusz Rajski, chief scientist and director of DFT Engineering at Mentor Graphics Corp. Rajski will detail how nanometer technology's has affected testing far beyond increased gate counts and higher frequencies.

Rajski will argue that the new types of defects introduced by complex copper interconnects and low-k dielectric materials will require new test solutions.

- Nicolas Mokhoff

EE Times





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