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TriQuint, Amkor partner on flip-chip process

Posted: 27 Aug 2003 ?? ?Print Version ?Bookmark and Share

Keywords:triquint semiconductor? amkor technology? flip-chip assembly? gaas semiconductor? cuflip bumping technology?

TriQuint Semiconductor Inc., a supplier of products for the mobile phone market, has collaborated with Amkor Technology Inc. to commercialize a low-cost flip-chip assembly process for GaAs semiconductors based on TriQuint's CuFlip bumping technology.

The CuFlip process is compatible with standard laminate substrate materials. Semiconductors manufactured for CuFlip assembly require substantially less processing compared to products intended for wire-bond assembly, resulting in lower cost due to higher-yield, faster cycle time, reduced work-in-progress, and lowered capital equipment expenses.

"Amkor has been an excellent partner in the development of our CuFlip assembly process. Their extensive expertise in flip-chip assembly and process development has helped us meet our performance and scheduled requirements," said Ron Ruebusch, TriQuint VP of TriQuint's Oregon Operations.





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