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Toshiba to use Applied Materials low-k films

Posted: 29 Aug 2003 ?? ?Print Version ?Bookmark and Share

Keywords:toshiba? applied materials? low k dielectric film?

Toshiba Corp. has selected Applied Materials Inc.'s Black Diamond and BLOk low-k dielectric films to be used for volume production of its advanced 90nm CMOS4 process in the Toshiba Oita, Japan facility. According to Toshiba, they will utilize Applied Materials' low-k dielectric films to meet the performance and lower power consumption required for its TC300 family of ASICs, which are now being incorporated in wireless devices, networking, and server products.

"Our TC300 family is targeted at next-generation, high-end applications ranging from portable wireless devices to high-speed networking and server products," said Dr. Masakazu Kakumu, technology executive of Toshiba Semiconductor Co. "Through a combination of design and manufacturing technologies, including 11 layers of copper wiring and Applied Materials' low-k films, we are able to meet the most advanced performance and low power requirements for these applications. For example, integrating Black Diamond and BLOk has enabled us to reduce power consumption by almost 50 percent and capacitance by 16 percent."

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