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Maxwell rolls hermetic die-based stack-packaging

Posted: 03 Sep 2003 ?? ?Print Version ?Bookmark and Share

Keywords:maxwell technologies? rad-stak? radiation shielding technology? mil-std-883?

Maxwell Technologies Inc. has introduced Rad-Stak, a radiation shielding technology that utilizes stacked packaging to create fully space-qualified components. Claimed as an industry first, the stacked packaging technology is specialized for providing high-density memory, and is subject to full MIL-STD-883 qualification and characterization.

The company's Synchronous Dynamic Random Access Memory (SDRAM) uses the Rad-Stak technology, making it hermetic and completely radiation-shielded in a vertically stacked package. The SDRAM is also claimed as the first space-qualified and radiation characterized memory component that is not repackaged plastic components, but rather packaged bare die.

Rad-Stak is offered in 132-pin and 68-pin standard package outlines. The design also allows the packaging to be applicable in both multichip modules using identical die and true hybrids, and to be used across product lines.





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