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Chipmos to expand FBGA, TSOP monthly outputs

Posted: 05 Sep 2003 ?? ?Print Version ?Bookmark and Share

Keywords:chipmos technology? fbga? tsop? ddr400? cof?

Chipmos Technology Inc. will be expanding its FBGA packaging devices by 100 percent this month. The company's current monthly capacity for FBGA and TSOP packaging devices is 24 million units. S.T. Cheng, president & CEO, said, "The FBGAs will replace the traditional TSOP packaging devices in early 2004. In addition, the FBGA packaging will upgrade the yield rate of DDR400 devices. Our yield rate for FBGA packaging is over 99.85 percent. The reliability has reached the Jedec Level 3 standard."

The company's monthly capacity for fine-pitch BGA stacked, COF and COG including CSP (chip-scale packaging) and MCM devices for this year is six million units. Cheng noted, "We are now capable of handling packaging and testing of 12-inch wafers, with a monthly capacity of 14 million units."

For IC testing, Cheng stated, "The trend is toward high-frequency DDRIII533 units. Starting early next year, DDRII will share about 10 to 20 percent of the market. In addition, the units will be the market mainstream in 2005."

According to Chipmos, the company is equipped with three 1GHz T5592 high-frequency IC testers for high-frequency IC testing. It could test devices with clock speeds of 533MHz.





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