Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

IBM, Intersil sign foundry services pact

Posted: 16 Sep 2003 ?? ?Print Version ?Bookmark and Share

Keywords:ibm? intersil? foundry service? semiconductor process technology? chip manufacturing?

IBM Microelectronics and Intersil Corp. have entered into a multi-year foundry services agreement. The companies plan to install Intersil semiconductor process technology in IBM's chip manufacturing facility in Burlington, Vermont. IBM will serve as a second source manufacturer for Intersil's Endura power management ICs. IBM plans to reserve capacity for Intersil's power management IC's manufactured in Intersil's P6 process.

The agreement marks an expansion of IBM's foundry services capabilities into power management and other high-performance analog applications. IBM plans to begin manufacturing Intersil's power management ICs in Q1 2004.

Article Comments - IBM, Intersil sign foundry services ...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top