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Sanyo expands coverage of Tessera license pact

Posted: 26 Sep 2003 ?? ?Print Version ?Bookmark and Share

Keywords:sanyo? tessera? semiconductor packaging? consumer electronic?

Sanyo Electric Co. Ltd and Tessera Inc. have signed a new licensing agreement. Under this agreement, Sanyo has licensed Tessera's semiconductor packaging technology to package semiconductor devices utilized in a variety of consumer electronic products.

Included in Tessera's license with Sanyo are over 150 patents covering Tessera's Compliant Chip technology. This technology covers a broad range of chip-scale and multi-chip package types, including IC devices packaged in "face-down," "face-up," "fold-over," "stacked," and "system-in-package" (SiP) formats.

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