FSI launches technology for front-end processing

FSI Int. Inc. announced at the recently concluded Semicon Taiwan that its FlashClean technology has been successfully implemented on the Zeta 300 Spray Cleaning System in a Taiwan 300mm fab. FlashClean has reportedly shown productivity and defectivity improvements at the 65nm technology node. It has also increased throughput and met critical requirements for 65nm technology.

This system enhancement, field-proven for front-end-of-line (FEOL) film strips and wet etch applications, is now being offered to the semiconductor industry for front-end-of-line (FEOL) cleaning. The FlashClean is standard on new Zeta series of surface conditioning system orders. It is also available as a field upgrade for already installed Zeta Systems.

FSI's Zeta surface conditioning system includes fully automated configurations and semi-automated configurations for 8- and 6-inch wafer sizes. Designed for FEOL and BEOL cleaning processes at technology nodes of 130nm and below, the Zeta System is proven for a wide range of applications, including FEOL resist strip and post-ash clean, BEOL post-ash clean, salicide strip, C4 cleans, and wafer reclaim.

The system, in which wafers undergo dry-in, dry-out processing in a closed, nitrogen-purged chamber, makes use of a centrifugal spray technology. FSI's unique versatile chemical delivery technology then prepares the chemicals at controlled composition and temperature and delivers them directly onto the wafers.