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SiGen boosts efforts on nanotechnology licensing

Posted: 07 Oct 2003 ?? ?Print Version ?Bookmark and Share

Keywords:silicon genesis? sigen? soi? wafer technologies? nanotechnology process?

Silicon Genesis Corp. (SiGen), a developer of SOI and other engineered wafer technologies, has decided to focus its efforts primarily on licensing its NanoTechnology processes.

The SiGen NanoTec license family is a suite of capabilities that are expected to enable new innovations in NanoTechnology and takes advantage of SiGen's layer-transfer and engineered wafer technologies, as well as advanced process and equipment technologies. These licenses include NanoCleave, NanoSmooth, NanoBond, and NanoStrain.

SiGen's NanoCleave process for thin-film lamination and layer transfer is the foundation of SiGen's technology portfolio. Meanwhile, NanoSmooth is SiGen's proprietary, patented non-contact wafer smoothing technology, while NanoBond is SiGen's patented plasma-activated bonding process which claims to enable up to 30 times greater bond strengths than conventional wet bonding techniques.

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