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Manufacturing/Packaging??

Yamato Works reflow oven suits 300mm wafers

Posted: 16 Oct 2003 ?? ?Print Version ?Bookmark and Share

Keywords:yamato works? yamato?

The N2 reflow oven for solder bump forming from Yamato Works Co. Ltd features hot plate and upper far-infrared rays that can be used for heating. It also features a walking beam conveyance system, wafer adsorption holes, and three axis clean robots. The device coating processes on the hot plate surface.





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