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Amkor qualifies IC packages for consumer products

Posted: 04 Nov 2003 ?? ?Print Version ?Bookmark and Share

Keywords:Amkor Technology? IC packages? contract semiconductor assembly services? consumer electronics?

Amkor Technology Inc. announced that they have completed qualification for two IC packaging solutions in its J1 factory in Kitakami, Iwate-Prefecture, Japan.

The two qualified solutions are the Stacked Chip Scale Package (S-CSP) and the Very Thin ChipArray Ball Grid Array (CVBGA). These packages are widely used in cell phones and other wireless systems, PDAs, camcorders, and a broad range of high-end consumer electronics where applications increasingly demand thin, high-density packaging of semiconductor devices.

"This is an important addition to our capability in Japan," said Naohiko Urasaki, president of Amkor Japan. "Japan is the world's market leader in advanced cell phone and personal digital device manufacturing. Both the S-CSP and the CVBGA solve packaging needs for these continually evolving consumer products."

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