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TI, Sun Micro partner on wireless solutions

Posted: 04 Nov 2003 ?? ?Print Version ?Bookmark and Share

Keywords:Texas Instruments? Sun Microsystems? wireless solutions? networks?

Texas Instruments Inc. (TI) and Sun Microsystems Inc. have collaborated to jointly deliver optimized end-to-end wireless solutions for 2.5G and 3G networks in the second quarter of 2004.

As part of this collaboration, TI licensed Sun Micro's Connected Limited Device Configuration HotSpot Implementation (CLDC HI) for integration into its family of TCS chipsets for GSM/GPRS, EDGE, CDMA and UMTS-enabled handsets and wireless OMAP applications processors in an effort to reduce the complexity of Java technology-enabled handset production and to ensure an enhanced consumer experience. TI expects to offer complete GPRS chipsets and handset reference designs including Sun Micro's CLDC HI by the second quarter of 2004.

TI and Sun Micro are also working together to provide an optimized implementation of Mobile Information Device Profile 2.0 (MIDP 2.0) on TI's TCS wireless chipsets and OMAP processors. These joint efforts are aimed to simplify the design of optimized, Java technology-enabled devices, thus reducing development costs and time-to-market for mobile device manufacturers. The optimized implementation of MIDP 2.0 that interoperates with CLDC HI on TI's OMAP platform is expected to be available from Sun by the second quarter of 2004.

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