STATS introduces 0.50mm version of QLP

ST Assembly Test Services Ltd (STATS) has added a super thin version of its Quad Leadless Package (QLP) to its technology portfolio. Referred to as QLP-T ("T" for "thin"), the advanced package offers a high performance, low profile solution for wireless applications.

With the company's QLP-T, the overall package thickness has been reduced using a thinner leadframe and lower mold cap without sacrificing Moisture Sensitivity Level (MSL) performance or package reliability. The QLP-T delivers a cost effective solution in a 0.50mm package profile. Suitable applications include power amplifiers and converters where the application space is limited in both size and height.

The QLP-T is available in various QLP family body sizes in standard, lead-free and "Green" materials sets based on the JEDEC MSL-2 standard at 260°C reflow temperatures.