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SDK offers etching gas for chip processing

Posted: 24 Nov 2003 ?? ?Print Version ?Bookmark and Share

Keywords:showa denko kk? hexafluoro? butadiene? c4f6? etching gas?

Showa Denko K.K. has developed a hexafluoro-1, 3-butadiene (C4F6) dry etching gas that is targeted for semiconductor processing applications. The C4F6 enables dry etching at a line width of as narrow as 90nm or less. Fluorocarbon gases are widely used for processing silicon oxide film. Compared with octafluorocyclobutane (C4F8) currently used for processing at the line width of 130nm, the product has low environmental load as it is decomposed in less than two days in the atmosphere. It also features a high aspect ratio, resulting in narrow and deep grooves and high selectivity.

The company will import crude C4F6 produced in commercial quantities in Russia for purification at its Kawasaki, Japan Plant.





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