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ASE deploys multiple 300mm wafer bumping system

Posted: 04 Dec 2003 ?? ?Print Version ?Bookmark and Share

Keywords:suss microtec? advanced semiconductor engineering? ase? semiconductor packaging? testing equipment?

SUSS MicroTec AG announced that Advanced Semiconductor Engineering Inc. (ASE), a semiconductor packaging and testing company, has recently purchased and has installed multiple 300mm SUSS lithography systems.

The equipment package includes several MA300 Plus Full Field Lithography systems and several ACS300Plus Coat/Develop wafer-processing Clusters, which ASE will use to expand its 300mm solder bumping capacity and advance its solder bumping technology. The shipments also include key elements of SUSS's recently introduced SupraYield technology.

Installations are scheduled to be completed in Q4 2003.

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