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Philips metrology technology selected by Ebara

Posted: 05 Dec 2003 ?? ?Print Version ?Bookmark and Share

Keywords:philips electronics? ebara? chemical mechanical polishing system?

Royal Philips Electronics announced that Ebara Corp.'s Precision Machinery Group, a supplier of chemical mechanical polishing systems (CMP), has chosen Philips' SurfaceWave Technology for its primary metal thickness characterization metrology.

Developed by Philips Advanced Metrology Systems Inc. (Philips AMS), Philips' metrology business unit, the SurfaceWave Technology is being used by Ebara as a reference and characterization tool for online metal metrology of 200mm and 300mm wafers during key polishing and CMP processes.

The patented SurfaceWave Technology is designed to provide high-throughput, low cost of ownership (COO), non-contact and non-destructive measurements of the thickness and uniformity of copper and low-k dielectric features. Ebara is using the Philips AMS Series 1200 with SurfaceWave technology to measure not only blanket monitor 200mm and 300mm wafers, but also patterned samples including arrays of finely patterned features such as lines and vias.





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