Toshiba offers lead-free packaging

Toshiba America Electronic Components Inc. (TAEC) announced that many of its power semiconductor package types will be manufactured using either lead-free packaging or lead-free finishes.

TAEC's line of power devices feature high-power IGBT modules and press packs, plus a line of medium-power devices that include MOSFETs, bipolar transistors, schottky barrier diodes, intelligent power modules, thyristors and triacs, and rectifiers. The devices are optimized for industrial control applications, while the medium-power devices are targeted for use in portable applications where small size and performance are important factors.

Toshiba's lead-free power devices are available with tin-silver or tin-copper lead-free plating that meet or exceed the requirements of the joint IPC/JEDEC standard J-STD-020B. The packaging is also compliant with European Union requirements which take effect in 2005.

According to TAEC, because some of its customers are not making the transition to lead-free manufacturing, the company will continue to offer power semiconductor components in the original package finish.