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NEC ASICS supported by Cadence platform

Posted: 12 Dec 2003 ?? ?Print Version ?Bookmark and Share

Keywords:nec? instant silicon solution platform? issp? asic? cadence design?

NEC Electronics Corp. has announced that its Instant Silicon Solution Platform (ISSP) family of structured ASICs will be supported by Cadence Design Systems Inc.'s Encounter digital IC design platform.

The Encounter platform is a new-generation IC implementation system used for completing large-scale SoC designs within short, predictable development cycles, from synthesis and silicon virtual prototyping through final chip implementation. ISSP support in Encounter is expected to allow fast, full-chip timing closure with integrated SI-aware routing. According to NEC, when used in the back end of the ISSP design flow, Encounter can reduce design turnaround time by up to 50 percent compared to conventional design flows.

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