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ASE packages austriamicrosystems wireless communication device

Posted: 19 Dec 2003 ?? ?Print Version ?Bookmark and Share

Keywords:advanced semiconductor engineering? ase? semiconductor packaging? leadframe-based package?

Advanced Semiconductor Engineering Inc. (ASE), a semiconductor packaging and testing company, announced that austriamicrosystems' new low-power radio transmitter/receiver ASIC has been packaged using ASE's Quad Flat No Lead (QFN) solution.

QFN is a leadframe-based package that is suitable for high speed and high frequency applications in low to medium pin count packages. This package demonstrates reduced electrical parasitics well suited for RF applications, lower thermal resistance, reduced physical dimensions and lighter weight.





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