Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

EVG equipment deployed in Beijing's Tsinghua-Foxconn Nanotechnology Center

Posted: 22 Dec 2003 ?? ?Print Version ?Bookmark and Share

Keywords:ev group? evg? mems? semiconductor wafer processing equipment? wafer processing tools?

EV Group (EVG), a manufacturer of MEMS and semiconductor wafer processing equipment, has successfully installed several advanced wafer processing tools at Tsinghua-Foxconn Nanotechnology Center at National Tsinghua University (NTHU), located in Beijing.

EVG has installed an EVG101 resist coating system, an EVG101 develop system, an EVG301 cleaner, an EVG620 precision alignment system for double-side lithography and an EVG520HE hot embossing and nanoimprinting system. This manufacturing line constitutes the most essential part of the production infrastructure and covers all process steps for MEMS and nano fabrication.





Article Comments - EVG equipment deployed in Beijing's ...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top