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Matsushita to build 300mm fab

Posted: 29 Dec 2003 ?? ?Print Version ?Bookmark and Share

Keywords:matsushita electric? 300mm? wafer? optical disk system? digital tv receiver?

Matsushita Electric Ind. Co. Ltd, confirmed on Tuesday (December 23, 2003) that it is investing about 130 billion yen (about $1.2 billion) to build a 300mm wafer fab.

The new fab will be in the adjacent site to its Uozu fab in Toyama Prefecture and is targeted to begin operation in 2005. Planned capacity for the fab has not been nailed down yet, said a Matsushita spokesman.

Matsushita's semiconductor business has been focusing on four consumer electronics domains: optical disk systems, digital TVs, mobile phones, and networking.

At its most advanced Arai fab in Niigata prefecture, Matsushita has been producing ICs for digital HDTVs since August 2002 using its 6-copper layer 0.13?m CMOS process.

The new fab, which will be equipped to accommodate 90nm to 65nm technology nodes, will focus on production of SoC for digital audio/video and mobile phone products.

Both Matsushita and Sony are aiming their chips for use in their own consumer electronics products and use the ICs to differentiate them. Sony earlier announced a 500 billion yen (about $4.8 billion) investment in semiconductors, which includes funds for a 300mm wafer line to be installed in its Nagasaki fab by 2005.

Yoshiko Hara

EE Times

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