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Vishay capacitors reduce board size by 45 percent

Posted: 14 Jan 2004 ?? ?Print Version ?Bookmark and Share

Keywords:vishay intertechnology? rf capacitor? hpc0402a?

Vishay Intertechnology Inc. has released what it claims as the industry's first silicon-based RF capacitor that reduces the board space required for circuitry in cellphones and other wireless communication systems.

Targeted for use in wireless communications, GPS systems, VCOs, filter and matching networking and power amplifiers, the HPC0402A provides the same broad range of capacitance values as conventional capacitors while delivering high stability over a wide frequency range, high Q factors, low ESR values and highly accurate dimensions.

The construction of the device decreases the distance between components, reducing parasitic lines and improving circuit performance. Its bump structure eliminates the tombstone effect, providing a flat top area for better pick-and-place assembly and allowing board-size reductions of up to 45 percent.

Available in 6-, 10-, 16- and 25V options, the product features overall capacitance ranges from 0.6pF up to 180pF with tight tolerance to 1 percent or 0.05pF. It measures 1.02-by-0.51mm, with a height of 0.40mm. Temperature coefficient of capacitance is 30ppm/C over an operating temperature range of -55C to 125C.

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