Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > T&M

STATS offers FCLGA package for wireless apps

Posted: 22 Jan 2004 ?? ?Print Version ?Bookmark and Share

Keywords:st assembly test services? flip chip land grid array? fclga?

ST Assembly Test Services Ltd has qualified an environment-friendly version of its Flip-Chip Land Grid Array (FCLGA) package.

The FCLGA offers a smaller form factor with increased routing density and improved electrical performance. A 0.65mm nominal package thickness is achieved by using a thin core, high density laminate substrate, solder wetable I/Os lands and thinned die.

The lead-free package is targeted at high frequency and/or high data rate applications such as mobile phones, WLAN modules, PDAs, digital cameras and camcorders.

Article Comments - STATS offers FCLGA package for wirel...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top