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STATS offers FCLGA package for wireless apps

Posted: 22 Jan 2004 ?? ?Print Version ?Bookmark and Share

Keywords:st assembly test services? flip chip land grid array? fclga?

ST Assembly Test Services Ltd has qualified an environment-friendly version of its Flip-Chip Land Grid Array (FCLGA) package.

The FCLGA offers a smaller form factor with increased routing density and improved electrical performance. A 0.65mm nominal package thickness is achieved by using a thin core, high density laminate substrate, solder wetable I/Os lands and thinned die.

The lead-free package is targeted at high frequency and/or high data rate applications such as mobile phones, WLAN modules, PDAs, digital cameras and camcorders.





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