Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

MEMC to adopt SiGen SOI wafer technology

Posted: 26 Jan 2004 ?? ?Print Version ?Bookmark and Share

Keywords:memc electronic materials? silicon genesis? wafers? silicon-on-insulator? soi?

MEMC Electronic Materials Inc. has entered into a licensing agreement with Silicon Genesis Corp. (SiGen), to manufacture wafers using their layer transfer technology. SiGen is a developer of Silicon-On-Insulator (SOI) and other engineered wafer technologies.

The agreement allows MEMC to utilize SiGen's NanoTec suite of process capabilities in the production of layer transfer wafer products, including SOI and strained SOI. The benefits of SiGen's technology are realized through the use of proprietary non-contact wafer smoothing technology following the room temperature cleaving of plasma-activated bonded wafers.

This technology is expected to allow substantially improved bonded SOI layer uniformity, which will be required for fully depleted SOI applications that will enter the mainstream beyond the 65nm node.





Article Comments - MEMC to adopt SiGen SOI wafer techno...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top