Indium releases Pb-free soldering products

Indium Corp. has developed several Pb-free soldering products.

The NC-SMQ230 is a solder paste for surface-mount. Providing extended stencil life and tack time, the product is an air reflow, no-clean material formulated to accommodate the high processing temperatures required by Sn/Ag/Cu and Sn/Ag Pb-free alloy systems.

The PK-001 and PK-002 flip-chip epoxy fluxes are designed for use with Sn62 and Sn 63 eutectic solders, with the PK-002 specially designed for Pb-free applications. Both environmentally friendly materials are fast curing, halide-free, no-clean fluxes which can be used for flip-chip or CSP soldering processes. The products have a stable thermoset residue, and are compatible with standard underfill materials, conformal coatings, and most finishes and coatings.