Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

STATS to merge with ChipPAC

Posted: 12 Feb 2004 ?? ?Print Version ?Bookmark and Share

Keywords:st assembly test services? chippac? mixed-signal test? strip test? chip-scale?

ST Assembly Test Services Ltd (STAT) and ChipPAC Inc. have agreed to merge their businesses to create an independent semiconductor assembly and test solutions company. The combined entity will be, named STATS ChipPAC Ltd, and be headquartered in Singapore.

STATS ChipPAC services will include mixed-signal test, strip test, chip-scale, stacked die, flip-chip, wafer level and system-in-package technologies, and wafer bumping capabilities. Its global operations will span China, South Korea, Malaysia, Singapore, Taiwan, and the U.S.

Charles Wofford, chairman of STATS, will remain chairman of the new company; Dennis McKenna will be the vice-chairman; and Tan Lay Koon, president and CEO of STATS, will hold those titles in the combined company.





Article Comments - STATS to merge with ChipPAC
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top