Powerchip to make DDR-II using 0.11?m technology

Powerchip Semiconductor Corp. will launch an advanced 0.11?m process technology at its 12-inch wafer fab to make DDR-II units. Chairman Frank Huang predicts that the DDR-II units will be the mainstream in the market next year. "Using 0.11?m process technology in manufacturing this products will enable us to offer competitive prices. Therefore, there is a need for us to launch this line as soon as possible."

In addition, Powerchip is raising funds for its second 12-inch wafer fab (12B). Installation of production equipment is set next month. The initial monthly capacity is 10,000 to 15,000 units of 12-inch wafers. Meanwhile, the company plans to expand production at its first 12-inch wafer fab with an output of 35,000 wafers during the second half of 2004.