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Toshiba sets up 300mm wafer fab in Kyushu

Posted: 24 Feb 2004 ?? ?Print Version ?Bookmark and Share

Keywords:toshiba? 300mm? wafer? nand? flash memory?

Toshiba Corp. has completed the construction of a new 300mm-wafer fabrication facility at its Oita operations in Kyushu, Japan. The new fab is scheduled to start production during the second half of this year, with a capacity of 12,500 wafers a month, and could be further expanded if necessary, up to a capacity of 17,500 wafers a month.

In the future, Toshiba expects the new fab to lead the industry in introducing 45nm process technology and applying it to SoC devices. The company also anticipates the Oita facility to support them in promoting high-performance SoC LSIs with extremely high levels of integration.

The Oita fab is the first of two advanced 300mm wafer facilities that Toshiba plans to construct. The second, to be built at Yokkaichi operations in Mie, Japan, will support the company in meeting the growing demand for NAND Flash memory.

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