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Airoha expands portfolio with wireless chips

Posted: 01 Mar 2004 ?? ?Print Version ?Bookmark and Share

Keywords:airoha technology? transceiver chip? 802.11g? wireless lan? benq?

Fabless RF IC designer Airoha Technology Corp. is boosting its portfolio with a series of transceiver chips and modules designed for cellphones and 802.11g wireless-LAN-enabled devices.

Airoha, a subsidiary of Taiwan-based electronics maker BenQ Corp., came into the market a little late last year with a single-chip, direct-conversion 802.11b RF transceiver but is trying to make up for it with a flurry of product activity now.

It's breaking into the cellular market with the AG2550 single-chip RF IC for quad-band GSM/GPRS phones. The chip could supplant potentially costlier components in phones made by BenQ, which sells its own brand of phones and also designs them for others, such as Motorola.

Packaged in a 32-pin, 25mm? land grid array, the receiver integrates four differential low-noise amplifiers, direct downconversion mixers, selectable baseband filters and programmable gain amplifiers. To deal with dc offset, Airoha has included autocalibration circuitry that mitigates local-oscillator leakage.

In the transmitter, the AG2550 uses a digital direct-modulation architecture to reduce current draw. In GSM mode, it consumes 50mA to transmit and 65mA to receive.

Airoha is also rolling out a 802.11b/g transceiver, the AL2230, that integrates a power amplifier and power detector, as well as such passives as baseband and loop filters, in a 7-by-7mm QFN package. The embedded PA can deliver 17dBm or 21dBm output in orthogonal frequency-division multiplexing or complementary code-keying mode, respectively.

Airoha is also offering an RF module - the AL2215LP - for handheld devices such as PDAs, smart phones, voice-over-Internet Protocol handsets and other battery-powered devices. The low-power device is housed in a 36mm? module combining Airoha's AL2210LP 802.11b RF transceiver, RF matching circuitry and integrated passive filters in a low-temperature co-fired ceramic package.

- Mike Clendenin

EE Tines

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